Automated Assembly
For high-volume assembly, most users will want to auto-place the modules.
The modules have been designed to maintain compatibility with reflow
processing techniques; however, due to their hybrid nature, certain aspects
of the assembly process are far more critical than for other component
types.
Following are brief discussions of the three primary areas where caution
must be observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the
reflow stage. The reflow profile below should not be exceeded, since
excessive temperatures or transport times during reflow will irreparably
damage the modules. Assembly personnel will need to pay careful
attention to the oven’s profile to ensure that it meets the requirements
necessary to successfully reflow all components while still remaining within
the limits mandated by the modules. Figure 23 shows the
recommended reflow oven profile for the modules.
300
250
200
150
100
50
255°C
235°C
217°C
185°C
180°C
125°C
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
0
30
60
90
120
150
180
210
240
270
300
330
360
Time (Seconds)
Figure 23: Maximum Reflow Profile
– 20 –
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